Japanese corporation Canon, renowned for its expertise in cameras and printers, has unveiled a groundbreaking solution designed to revolutionize semiconductor component production.
Canon’s “nanoimprint lithography” system, introduced on October 13, is a bold move to compete with the dominant Dutch firm ASML in the realm of extreme ultraviolet (EUV) lithography machines. These machines play a pivotal role in the creation of cutting-edge chips, including those featured in the latest Apple iPhones.
The use of EUV machines has become entangled in the technological rivalry between the United States and China. The United States has imposed export restrictions and various sanctions, aimed at impeding China’s access to vital chips and manufacturing equipment.
This strategy has hindered the advancement of the world’s second-largest economy in a field where it is striving to catch up.
ASML’s EUV technology has gained immense popularity among top chip manufacturers due to its pivotal role in enabling the production of semiconductors at 5 nanometers and below. This nanometer measurement denotes the size of chip features, with smaller values accommodating more features on a chip, consequently boosting semiconductor performance.
Canon’s new system, FPA-1200NZ2C, not only produces 5-nanometer semiconductors but also offers scalability down to 2 nanometers, surpassing the capabilities of Apple’s A17 Pro chip found in the iPhone 15 Pro and Pro Max.
Canon’s entry into this competitive landscape challenges ASML’s stronghold, promising exciting developments in the semiconductor industry.
